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FPF3042 Datasheet

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Absolute Maximum Ratings
Stresses exceeding the Absolute Maximum Ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameters
Min. Max. Unit
VPIN
VIN, VBUS to GND
VOUT to GND(3)
Continuous
Pulsed, 100 ms Maximum Non-Repetitive
-1.4
18.0
-2.0
-0.3 16.0
EN, DF_IN, VIN_SEL, Other_VIN_AVA to GND
-0.3 6.0
TA=25°C
2.70
ISW Maximum Continuous Switch Current per Channel
TA=65°C
TA=75°C
2.70
2.50
TA=85°C
2.25
tPD Total Power Dissipation at TA=25°C
2.25
TJ Operating Junction Temperature
-40 +150
TSTG
ϴJA
Storage Junction Temperature
Thermal Resistance, Junction-to-Ambient (1in. Square Pad of 2 oz. Copper)
-65 +150
55(4)
Human Body Model, ANSI/ESDA/JEDEC JS-001-2012 3.0
ESD
Electrostatic
Discharge Capability
Charged Device Model, JESD22-C101
IEC61000-4-2 System Level(5)
Air Discharge
(VIN, VBUS to GND)
Contact Discharge
(VIN, VBUS to GND)
1.5
15.0
8.0
Notes:
3. If an external voltage of more than 13 V is applied to VOUT, the slew rate should be <1 V/ms from 13 V.
4. Measured using 2S2P JEDEC standard PCB.
5. System-level ESD can be guaranteed by design.
V
A
W
°C
°C
°C/W
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameters
Min. Max. Unit
VPIN
VIN
VBUS
TA Ambient Operating Temperature
4.0 12.4
4.0 12.4
V
-40 +85 °C
© 2013 Fairchild Semiconductor Corporation
FPF3042 Rev. 1.0.1
6
www.fairchildsemi.com
Fairchild Semiconductor
Fairchild Semiconductor


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