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FPF3042 Datasheet

Power-Source-Selector Switch

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FPF3042 pdf
August 2014
IntelliMAX18 V-Rated, Dual-Input, Single-Output,
Power-Source-Selector Switch
Dual-Input, Single-Output Load Switch (DISO)
Input Supply Operating Range:
- 4.0 V~12.4 V at VIN
- 4.0 V~12.4 V at VBUS
Typical RON:
- 95 mΩ at VIN=5 V
- 70 mΩ at VBUS=5 V
Bidirectional Switch for VIN and VBUS
Slew Rate Controlled:
- 50 µs at VIN for < 4.7 µF COUT
- 90 µs at VBUS for < 4.7 µF COUT
Maximum ISW: 2.7 A per Channel
Break-Before-Make Transition
Under-Voltage Lockout (UVLO)
Over-Voltage Lockout (OVLO)
Thermal Shutdown
Logic CMOS IO Meets JESD76 Standard for GPIO
Interface and Related Power Supply Requirements
ESD Protected:
- Human Body Model: >3 kV
- Charged Device Model: >1.5 kV
- IEC 61000-4-2 Air Discharge: >15 kV
- IEC61000-4-2 Contact Discharge: >8 kV
The FPF3042 is an 18 V-rated Dual-Input Single-Output
(DISO) load switch consisting of two channels of slew-
rate-controlled, low-on-resistance, N-channel MOSFET
switches with protection features. The slew-rate-
controlled turn-on characteristic prevents inrush current
and the resulting excessive voltage droop on the input
power rails. The input voltage range operates from 4.0 V
to 12.4 V at both VBUS and VIN to align with the needs of
high-voltage portable device power rails.
Both VIN and VBUS have the over-voltage protection of
14 V (typical) to avoid damage to the system.
VIN and VBUS bidirectional switching allows reverse
current from VOUT to VIN or VBUS for On-The-Go, (OTG)
Mode. The switching is controlled by logic input EN and
VIN_SEL is capable of interfacing directly with low-voltage
control signal General-Purpose Input / Output (GPIO).
FPF3042 is available in 1.76 mm x 1.96 mm Wafer-
Level Chip-Scale Package (WLCSP), 16-bump, 0.4 mm
Input Power-Selection Block Supporting USB and
Wireless Charging
Smart Phone / Tablet PC
Ordering Information
Part Number
Typical RON per
Channel at 5 VIN
95 for VIN
70 for VBUS
Rise Time (tR)
50 µs for VIN
90 µs for VBUS
16-Bump, 1.76 mm x 1.96 mm,
Wafer-Level Chip-Scale Package
(WLCSP), 0.4 mm Pitch
© 2013 Fairchild Semiconductor Corporation
FPF3042 • Rev. 1.0.1
Fairchild Semiconductor
Fairchild Semiconductor

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