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FPF3040 Datasheet
18V-Rated Dual Input Single Output Power-Source-Selector Switch
Fairchild Semiconductor
Fairchild Semiconductor

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FPF3040 pdf
November 2014
IntelliMAX18 V-Rated Dual Input Single Output
Power-Source-Selector Switch
Dual-Input, Single-Output Load Switch
Input Supply Operating Range:
- 4~10.5 V at VIN
- 4~6.5 V at VBUS
Typical RON:
- 95 mΩ at VIN=5 V
- 70 mΩ at VBUS=5 V
Bi-Directional Switch for VIN and VBUS
Slew Rate Controlled:
- 50 µs at VIN for < 4.7 µF COUT
- 90 µs at VBUS for < 4.7 µF COUT
Maximum ISW: 2 A Per Channel
Break-Before-Make Transition
Under-Voltage Lockout (UVLO)
Over-Voltage Lockout (OVLO)
Thermal Shutdown
Logic CMOS IO Meets JESD76 Standard for GPIO
Interface and Related Power Supply Requirements
ESD Protected:
- Human Body Model: >3 kV
- Charged Device Model: >1.5 kV
- IEC 61000-4-2 Air Discharge: >15 kV
- IEC61000-4-2 Contact Discharge: >8 kV
The FPF3040 is a 18 V-rated Dual-Input Single-Output
(DISO) load switch consisting of two channels of slew-
rate-controlled, low-on-resistance, N-channel MOSFET
switches with protection features. The slew-rate-
controlled turn-on characteristic prevents inrush current
and the resulting excessive voltage droop on the input
power rails. The input voltage range operates from
4 V to 6.5 V at VBUS and from 4 V to 10.5 V at VIN to
align with the needs of low-voltage portable device
power rails.
VIN and VBUS have the over-voltage protection
functionality of typical 12 V and 7.5 V, respectively, to
avoid unwanted damage to system.
VIN and VBUS bi-directional switching allows reverse
current from VOUT to VIN or VBUS for On-The-Go, (OTG)
Mode. The switching is controlled by logic input EN and
VIN_SEL is capable of interfacing directly with low-voltage
control signal General-Purpose Input / Output (GPIO).
FPF3040 is available in 1.8 mm x 2.0 mm Wafer-Level
Chip-Scale Package (WLCSP), 16-bump, 0.4 mm pitch.
Input Power Selection Block Supporting USB and
Wireless Charging
Smartphone / Tablet PC
Ordering Information
Part Number
Typical RON per
Channel at 5VIN
95 for VIN
70 for VBUS
Rise Time (tR)
50 µs for VIN 1.8 mm x 2.0 mm Wafer-Level Chip-Scale
90 µs for VBUS Package (WLCSP), 16-Bump, 0.4 mm Pitch
© 2012 Fairchild Semiconductor Corporation
FPF3040 • Rev. 2.4.3

FPF3040 Datasheet PDF

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