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FPF3003 Datasheet

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FPF3003 pdf
Packaging Information
0.03 C
2X
E
AF
B
BALL A1
INDEX AREA
D
0.03 C
2X
TOP VIEW
0.05 C
0.06 C
0.625
0.547
E
0.40 (Ø0.20)
A1 Cu Pad
0.40 (Ø0.30) Solder
Mask Opening
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.378±0.018
0.208±0.021
C SEATING
PLANE D
SIDE VIEWS
0.40
0.40
1234
0.005 C A B
Ø0.260±0.02
16X
D
C
B (Y) ±0.018
A
F
(X) ±0.018
BOTTOM VIEW
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC016AArev2.
Figure 38. 1.6mmx1.6mm WLCSP, 16-Bumps 0.4mm Pitch
Product-Specific Dimensions
Product
D
FPF3003UCX
1560μm ±30μm
E
1560μm ±30μm
X
180μm
Y
180μm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2011 Fairchild Semiconductor Corporation
FPF3003 • Rev. 1.0.0
16
www.fairchildsemi.com
Fairchild Semiconductor
Fairchild Semiconductor



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