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FPF2702 Datasheet
Adjustable Over-Current Protection Load Switches
Fairchild Semiconductor
Fairchild Semiconductor


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FPF2702 pdf
Table 1.
RSET
(k)
111
124
147
182
220
274
374
549
RSET Selection Guide
Current Limit [A]
Min.
Typ.
Max.
2.00 2.50 3.00
1.79 2.24 2.69
1.51 1.89 2.27
1.22 1.52 1.83
1.01 1.26 1.51
0.81 1.01 1.22
0.59 0.74 0.89
0.40 0.51 0.61
Tol. (%)
20
20
20
20
20
20
20
20
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
100
200 300 400
RSET (k)
Figure 36. ILIM vs. RSET
500
600
Under-Voltage Lockout (UVLO)
The under-voltage lockout feature turns off the switch if
the input voltage drops below the under-voltage lockout
threshold. With the ON pin active (ON pin pulled LOW),
the input voltage rising above the under-voltage lockout
threshold causes a controlled turn-on of the switch
(Figure 37). The UVLO threshold voltage is set internally
at 2.5 V for VIN rising. The under-voltage lockout
threshold has a 0.1 V hysteresis.
ON
UVLO Threshold
Device Wake up
VIN
FLAGB
Rise time
10%VOUT
90%VOUT
VOUT
Figure 37. Under-Voltage Lockout Performance
Power Good
FPF270X has a power good feature. The PGOOD pin is
an open-drain MOSFET that asserts HIGH when the
output voltage reaches 90% of the input voltage (Figure
26). A typical 3% PGOOD hysteresis is added to
PGOOD to prevent PGOOD from chattering as VOUT
falls near the PGOOD threshold voltage.
The PGOOD pin requires an external pull-up resistor
connected to an external voltage source compatible with
input levels of other chips connected to this pin.
PGOOD is kept LOW when the device is inactive. To
save current in the OFF state, the pull-up resistor of the
PGOOD pin can be connected to the output voltage
when there is no battery, provided that compatibility with
the input levels of other devices connected to PGOOD
is observed. A typical value of 100 kΩ is recommended
for the pull up resistor. When the power-good feature is
not used in the application, the PGOOD pin can be
connected to GND.
Thermal Shutdown
Thermal shutdown protects the die from internally or
externally generated excessive temperatures. During an
over-temperature condition; as the temperature
increases above 140°C, FLAGB is activated and the
switch is turned off.
When the die cools down sufficiently (die temperature
drops below the threshold level), the switch
automatically turns on again. To avoid unwanted
thermal oscillations, a 30°C (typical) thermal hysteresis
is implemented between thermal shutdown entry and
exit temperatures. Proper board layout is required to
prevent premature thermal shutdown (see Figure 38 for
thermal shutdown behavior on FPF2702).
ON
VIN
VOUT
2V
IOUT
ILIM
Thermal Cycling
Device cools off
Over
current
condition
FLAGB
Figure 38. FPF2702 Thermal Shutdown Behavior
© 2010 Fairchild Semiconductor Corporation
FPF2700 / FPF2701 / FPF2702 Rev. 1.0.3
12
www.fairchildsemi.com

FPF2702 Datasheet PDF



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