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FPF2700 Datasheet

Adjustable Over-Current Protection Load Switches

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FPF2700 pdf
Physical Dimensions
0.15 C
2X
3.00
A
B
2.52
85
PIN1
IDENT
3.00
TOP VIEW
0.15 C
2X
0.10 C
0.80 MAX
0.08 C 0.05
0.00
SEATING
PLANE
SIDE VIEW
(0.20)
C
PIN 1
IDENT
2.45
2.35
14
(0.35) 4X
1.70 1.94
3.30
0.56 8X
1
0.65
4
0.47 8X
RECOMMENDED LAND PATTERN
NOTES:
A. PACKAGE CONFORMS TO JEDEC MO-229
EXCEPT WHERE NOTED.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY.
E. DRAWING FILENAME: MKT-MLP08Vrev1.
1.75
1.65
0.40
0.30
8X
8
0.65
0.10 C A B
5 0.05 C
0.40
0.30
8X
BOTTOM VIEW
Figure 47. 8-Lead, 3x3 mm Molded Leadless Package (MLP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/ML/MLP08V.pdf.
© 2010 Fairchild Semiconductor Corporation
FPF2700 / FPF2701 / FPF2702 • Rev. 1.0.3
18
www.fairchildsemi.com
Fairchild Semiconductor
Fairchild Semiconductor


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