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FPF1504 Datasheet
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Fairchild Semiconductor
Fairchild Semiconductor


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FPF1504 pdf
0.03 C
2X
E
F
A
B
PIN A1 AREA
TOP VIEW
D
0.03 C
2X
0.05 C
0.06 C
0.625
0.539
0.50
0.50
Bottom Cu Pad
Solder Mask
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
C
D
SEATING PLANE
SIDE VIEWS
0.50
4X
B
0.50
A
12
0.005 C A B
F
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 2009.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
BOTTOM VIEW
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILENAME: MKT-UC004ABrev3.

FPF1504 Datasheet PDF


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