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FPF1320 pdf
Physical Dimensions
0.03 C
2X
E AF
B
BALL A1
INDEX AREA
D
TOP VIEW
0.03 C
2X
0.05 C
0.06 C
0.625
0.539
E
(Ø0.350)
SOLDER MASK
OPENING
A1
(Ø0.250)
Cu Pad
(1.00)
(0.50)
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.332±0.018
0.250±0.025
C SEATING PLANE D
SIDE VIEWS
0.50
0.005 C A B
Ø0.315 +/- .025
6X
1.00
0.50
12
C
B (Y) ±0.018
A
F
(X) ±0.018
BOTTOM VIEW
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
±43 MICRONS (539-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC006AFrev2.
Figure 34. 6-Ball, 1.0 x 1.5 mm, Wafer-Level Chip-Scale Package (WLCSP)
Product-Specific Dimensions
Product
FPF1320UCX
FPF1321UCX
FPF1321BUCX
D
1460 µm ±30 µm
1460 µm ±30 µm
1460 µm ±30 µm
E
960 µm ±30 µm
960 µm ±30 µm
960 µm ±30 µm
X
230 µm
230 µm
230 µm
Y
230 µm
230 µm
230 µm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
http://www.fairchildsemi.com/dwg/UC/UC006AF.pdf
© 2011 Fairchild Semiconductor Corporation
FPF1320 / FPF1321 • Rev. 1.0.2
14
www.fairchildsemi.com
Fairchild Semiconductor
Fairchild Semiconductor



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