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(Datasheet) FDMS3600AS

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0.10 C
(2X)
8
5.10
4.90
PKG
CL
5
PKG CL
6.25
5.90
SEE
DETAIL B
5.90
5.70
0.28
0.08
0.35
0.15
10°
14
0.41
0.21
(8X)
TOP VIEW
0.10 C
(2X)
(SCALE: 2X)
5.00
4.80
SIDE VIEW
SEE
DETAIL C
0.10 C
8X
0.08 C
1.10
0.90
(SCALE: 2X)
0.35
0.15
C
SEATING
PLANE
0.45
0.25
(6X)
0.65
0.38
1
3.16
2.80
23
0.70
0.36
0.10
0.05
4 1.34
1.12
4.08
3.70
0.66±.05
2.25
2.05
0.65
0.38
0.44
0.24
1.02
8 7 6 5 0.82
1.27
0.61
0.31
(8X)
3.81
BOTTOM VIEW
CAB
C
NOTES: UNLESS OTHERWISE SPECIFIED
A) PACKAGE STANDARD REFERENCE:
JEDEC REGISTRATION, MO-240, VARIATION AA.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE BURRS OR
MOLD FLASH. MOLD FLASH OR BURRS DOES
NOT EXCEED 0.10MM.
D) DIMENSIONING AND TOLERANCING PER
ASME Y14.5M-1994.
E) IT IS RECOMMENDED TO HAVE NO TRACES
OR VIAS WITHIN THE KEEP OUT AREA.
F) DRAWING FILE NAME: PQFN08EREV6.
G) FAIRCHILD SEMICONDUCTOR
Fairchild Semiconductor
Fairchild Semiconductor


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