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BC846A Datasheet

SMD General Purpose NPN Transistors

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BC846 ... BC850
BC846 ... BC850
SMD General Purpose NPN Transistors
SMD Universal-NPN-Transistoren
IC = 100 mA
hFE = 180/290/520
Tjmax = 150°C
VCEO = 30...65 V
Ptot = 250 mW
Version 2015-10-30
~ SOT-23 (TO-236)
2.9 ±0.1
0.4+0.1
-0.05
3
Type
Code
1
1.9±0.1
2
1.1+0.1
-0.2
Typical Applications
Signal processing,
Switching, Amplification
Commercial grade 1
Features
General Purpose
Three current gain groups
Compliant to RoHS, REACH,
Conflict Minerals 1)
Mechanical Data 1)
Taped and reeled
Typische Anwendungen
Signalverarbeitung,
Schalten, Verstärken
Standardausführung 1)
Besonderheiten
Universell anwendbar
Drei Stromverstärkungsklassen
RoHS
Pb
Konform zu RoHS, REACH,
Konfliktmineralien 1
Mechanische Daten 1)
3000 / 7“
Gegurtet auf Rolle
1=B 2=E 3=C
Dimensions - Maße [mm]
Weight approx.
Case material
Solder & assembly conditions
0.01 g
UL 94V-0
260°C/10s
Gewicht ca.
Gehäusematerial
Löt- und Einbaubedingungen
MSL = 1
Maximum ratings (TA = 25°C)
Collector-Emitter-volt. – Kollektor-Emitter-Spannung
Collector-Base-voltage – Kollektor-Basis-Spannung
Emitter-Base-voltage – Emitter-Basis-Spannung
Power dissipation – Verlustleistung
Collector current – Kollektorstrom (dc)
Peak Collector current – Kollektor-Spitzenstrom
Junction temperature – Sperrschichttemperatur
Storage temperature – Lagerungstemperatur
Characteristics (Tj = 25°C)
DC current gain – Kollektor-Basis-Stromverhältnis
VCE = 5 V, IC = 10 µA
VCE = 5 V, IC = 2 mA
B open
E open
C open
Grenzwerte (TA = 25°C)
BC846
BC847
BC850
BC848
BC849
VCEO
65 V
45 V
45 V
30 V
VCBO
VEBO
80 V 50 V
6V
50 V
30 V
5V
Ptot 250 mW 2)
IC 100 mA
ICM 200 mA
Tj -55...+150°C
TS -55…+150°C
Kennwerte (Tj = 25°C)
Min.
Typ.
Max.
Group A
hFE
90
Group B
hFE
150
Group C
hFE
270
Group A
hFE
110
180
220
Group B
hFE
200
290
450
Group C
hFE
420
520
800
1 Please note the detailed information on our website or at the beginning of the data book
Bitte beachten Sie die detaillierten Hinweise auf unserer Internetseite bzw. am Anfang des Datenbuches
2 Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluss
© Diotec Semiconductor AG
http://www.diotec.com/
1
Diotec Semiconductor
Diotec Semiconductor



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