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B10S Datasheet

MINI SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER(VOLTAGE - 100 to 1000 Volts CURRENT - 0.5 Amperes)

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DATA SHEET
B1S~B10S
MINI SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
VOLTAGE - 100 to 1000 Volts CURRENT - 0.5 Amperes
FEATURES
• Plastic material used carries Underwriters
• Laboratory recognition 94V-O
• Low leakage
• Surge overload rating-- 30 amperes peak
• Ideal for printed circuit board
• Exceeds environmental standards of MIL-S-19500
MDI
.275 (7) MAX
.165 (4.2)
.150 (3.8)
Unit: inch ( mm )
.106 (2.7)
.090 (2.3)
MECHANICALDATA
Case: Reliable low cost construction utilizing molded plastic technique results in
inexpensive product
Terminals: Lead solderable per MIL-STD-202, Method 208.
Polarity: Polarity symbols molded or marking on body.
Mounting Position: Any.
Weight: 0.008 ounce, 0.22 gram.
.008 (.20)
.067 (1.7)
.057 (1.3)
C .02(5)
.051 (1.3)
.035 (0.9)
.043 (1.1)
.027 (0.7)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, Resistive or inductive load.
For capacitive load, derate current by 20%
Maximum Recurrent Peak Reverse Voltage
B1S B2S
100 200
B4S B6S
B8S
B10S
UNIT
400 600 800 1000
V
Maximum RMS Bridge input Voltage
70 140 280 420 560 700
V
Maximum DC Blocking Voltage
100 200 400 600 800 1000
V
Maximum Average Forward on glass-epoxy P.C.B (Note 1)
Current TA=30°C
on aluminum substrate (Note 3)
0.5 A
0.8
Peak Forward Surge Current, 8.3ms singlehalf sine-wave
superimposed on rated load
30.0
A
I2t Rating for fusing ( t < 8.35 ms)
5.0
A2t
Maximum Forward Voltage Drop per Bridge Element at 0.5A
1.00
V
Maximum Reverse Current at Rated TJ= 25°C
DC Blocking Voltage per element TJ=125°C
5.0 µA
mA
Typical Junction capacitance per leg (Note 1) CJ
25.0
pF
Typical Thermal resistance per leg (Note 2) RθJA
Typical Thermal resistance per leg (Note 2) RθJA
Operating Temperature Range TJ
85.0
-55 to 150
°C/W
°C
Storage Temperature Range TA
-55 to 150
°C
NOTES:
1. Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
2. Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.05 X 0.05"(13 x 13mm) copper pads.
3. On alum: substrate P.C.B with an rea of 0.8 x 0.8 x 0.25” ( 20 x 20 x 6.4mm ) mounte on 0.05 x 0.05 “( 13 x 13 mm ) solder pad.
PAGE . 1
Pan Jit International Inc.
Pan Jit International Inc.



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