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9015MG Datasheet

Silicon PNP transistor

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9015MG pdf
9015MG
Rev.E Mar.-2016
DATA SHEET
回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free)
说明:
1、预热温度 25150℃,时间 6090sec;
2、峰值温度 245±5℃,时间持续为 5±0.5sec;
3、焊接制程冷却速度为 210/sec.
Note:
1.Preheating:25~150, Time:60~90sec.
2.Peak Temp.:245±5, Duration:5±0.5sec.
3. Cooling Speed: 2~10/sec.
耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions
温度:260±5
时间:10±1 sec.
Temp.:260±5
Time:10±1 sec
包装规格 / Packaging SPEC.
卷盘包装 / REEL
Package Type
封装形式
SOT-23
Units/Reel
/卷盘
3,000
Reels/Inner Box
卷盘/
10
Units 包装数量
Units/Inner Box Inner Boxes/Outer Box
/
/
30,000
8
Units/Outer Box
/
240,000
Dimension 包装尺寸 (unitmm3)
Reel
Inner Box
Outer Box
7×8 180×120×180 385×257×392
使用说明 / Notices
http://www.fsbrec.com
6/6
FOSHAN BLUE ROCKET
FOSHAN BLUE ROCKET



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